MSL/TEL secures order for HVM process tool at tier-1 off-shore NVM project
- Daniel Montag
- Aug 6, 2022
- 1 min read
MSL/TEL secures order for HVM process tool at tier-1 off-shore NVM project
top of page
Your Source For Thin Film Process Solutions!
Attention Re: The European Chips Act
The EU has committed 43 billion euros ($47 billion) in public and private investment into European semiconductor manufacturing to boost European semiconductor manufacturing and reduce dependency on foreign semiconductor production to alleviate strain on the semiconductor supply chain.
NEWS
Search
bottom of page
Comments